They now use intrusive soldering that solders surface mount and through-hole components at the same time:
The idea behind intrusive soldering, also known as pin-in-paste soldering is simple: solder paste is printed onto or around a through-hole pad, and the through-hole component is passed into reflow with your SMD components. The molten solder paste then fills in the through-hole and attaches the component pin.
I used to work on an SMT line, and pin in paste was the bane of my fucking existence. The parts (mainly connectors) were rarely within tolerance, and a leg or two would consistently miss their holes, if not outright rejected by the inserter.
They now use intrusive soldering that solders surface mount and through-hole components at the same time:
I used to work on an SMT line, and pin in paste was the bane of my fucking existence. The parts (mainly connectors) were rarely within tolerance, and a leg or two would consistently miss their holes, if not outright rejected by the inserter.
So if I’m reading that right - higher failure rate on the line but those that passed I’d imagine have a higher rate of success?